Electronic components are becoming smaller and more complex.
High-resolution, high-magnification X-ray and computed tomography examinations support development, series monitoring and failure analysis. The X-ray images make production problems and material defects visible.
GWP is your contact for inspection tasks such as:
- Inspection of bonding wires and bonding surfaces
- Inspection of solder joints
- Analysis of SMD components, capacitors and coils
- Cavity analysis of conductive and non-conductive chip bonding compounds
- Analysis of printed circuit boards (Assembled Printed Circuit Boards - PCB)
- Analysis of missing solder joints, voids, solder bridges
- Characterization of sensors, electromechanical packages
- Analysis of connectors and crimps
- Examination of batteries and battery packs