Heat conduction films, also known as heat pads in their smaller form, are thermally conductive films that are usually designed as insulators, i.e. electrically non-conductive. They are made of relatively soft material that ensures low contact pressure and good contact.

In order to ensure an optimum transition from the component to be cooled to the heat sink, the use of heat conducting materials is necessary. The use of heat conducting foils compensates for unevenness and roughness of the surfaces, due to it’s softness. By displacing the ambient air they reduce the risk of a heat build-up.

GWP develops a ceramic, electrically non-conductive heat foil/heat pad and the associated manufacturing process. The foil should provide >12 Wm-1K-1 heat conduction in the industrial application of semiconductor components.