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X-ray residual stress measurement

Residual stresses in metallic components are the result of many different, overlapping influences. They can be introduced into the component, for example, by shaping manufacturing processes, heat treatment or mechanical processing. There they can then affect the strength. Determining the residual stress is therefore an important part of process monitoring and quality control for many applications. The non-destructive measurement of the stress states is carried out using X-rays on various materials (Fe, Al, Cu, Ti, Ni) on the surface or as a depth profile. In depth profile analysis, the material is removed without deformation by electrolytic etching in order not to affect the residual stresses.

The measurements are carried out in the GWP laboratory or (e.g. for larger components) on-site using a mobile device. An X-Stress 3000 (open X-ray diffractometer) is used.

In addition, the same methodology can be used to quantitatively determine ferrite and austenite or to determine residual austenite.

Standards: PV 1005

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Dr. Johannes Diller

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