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Dr. Fabian Schmidt
These powerful methods provide a wide range of tools for the comprehensive analysis of solids and surfaces, which are used in failure analysis, material development and quality assurance.
The SEM-EDX technique is one of the most important methods for investigating the topography, fracture surfaces and elemental composition of solids.
SEM (scanning electron microscopy):
The scanning electron microscope enables high-resolution imaging of surfaces with excellent depth of field. With a resolution in the double-digit nanometer range (up to 50.000x magnification), the sample is scanned by an electron beam in a high vacuum. The interactions generate secondary or backscattered electron signals that provide a detailed image of the surface structure. This method is particularly suitable for examining fracture surfaces and material defects.
EDX (energy dispersive X-ray spectroscopy):
Combined with the SEM, a modern EDX system allows precise elemental analyses even on the smallest samples. By exciting the atoms using an electron beam, the sample emits characteristic X-rays, which are detected by the silicon drift detector. The results are displayed as a spectrum or element distribution image. The method can detect elements from boron onwards; quantitative analysis with a detection limit of 0,1% by weight is possible from sodium onwards.
Norms: AV 272-Mat
Auger electron spectroscopy is one of the most surface-sensitive methods for elemental analysis. By bombarding the surface with high-energy radiation (UV or X-rays) or electron beams, atoms are excited, which emit electrons with characteristic kinetic energy.
The resulting spectra allow the assignment of elements and their concentrations. This non-destructive method is ideal for the analysis of semiconductors and metals, for example for the detection of carbon contamination on adhesive surfaces or electrical contacts. The detection limits are below 0,1 at%.
The ToF-SIMS technique analyzes the atomic and molecular composition of the top 1-3 monolayers of a solid. Heavy ions are fired at the surface, releasing secondary ions. These are analyzed in terms of their mass - with extremely high sensitivity (detection limits in the fmol range) and surface sensitivity.
ToF-SIMS enables imaging analyses from a resolution of about 1 µm and can create depth profiles using sputtering. Typical applications include adhesion failure, residual dirt analysis, metal cleaning, plastic additives, plasticizer migration, optical coatings and corrosion
X-ray photoelectron spectroscopy is used to qualitatively and quantitatively determine the composition of solids and surfaces. The analysis is limited to a penetration depth of a few nanometers. Depth profiles can also be created by removing layers.
All elements can be detected except hydrogen and helium. XPS offers a high sensitivity (approx. 0,1 at-%), especially for heavier elements. The method also enables statements to be made about the chemical state of the elements
X-ray diffraction is based on the diffraction of X-rays on crystal lattices. The atoms of a crystal act like a three-dimensional diffraction grating. Interference of the diffracted rays produces characteristic diffraction patterns from which conclusions can be drawn about the crystal structure, lattice parameters and chemical composition.
The method identifies and quantifies crystalline and amorphous components as well as different crystalline phases.
Glow discharge spectroscopy is a method for qualitative and quantitative element analysis that is particularly suitable for layered structures. During the analysis, the metallic sample is used as a cathode in an argon plasma. The surface is removed layer by layer by cathode sputtering.
The released atoms are excited by collisions in the plasma and emit photons with characteristic wavelengths. These are analyzed spectroscopically. Non-metallic samples can also be examined using a high-frequency alternating voltage.
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