damage to electrical components

The causes of failures and damage to electronic components are varied, as are the methods with which they can be detected and analyzed.

Environmental influences, vibrations or manufacturing errors can lead to premature failure. Time and cost pressures also increase the risk of quality problems. In the automotive sector, however, many electronic assemblies are safety-relevant parts: if these are affected by failures, there is a risk of recalls, which result in high costs and a loss of reputation.

We analyze test results from environmental simulations as well as field failures and thus create important insights for your product optimization.

GWP is an experienced partner in damage analysis. Using modern examination methods such as µ-CT, scanning electron microscopy and metallography, we get to the bottom of the cause of damage or malfunctions. In our own electronics and environmental simulation laboratory, we simulate stresses in order to locate weak points, carry out functional tests or estimate service lives. We also advise our customers on suitable remedial measures.

Examples of damage analyses on electronic assemblies and components:

1. Recall: Increased contact resistance at airbag connectors: Errors in Au galvanization lead to oxidation of exposed nickel: Damage to circuit boards
2. Failures of integrated circuits for high beam: glass formation on contact surface
3. Increased contact resistance of connectors due to contamination with silicone-containing pulling aids
4. Defective fuses on irons due to the use of primary crystal forming alloy
5. Burning of batteries of boat engines and vibration motors of massage chairs
6. Failures of SMD components, e.g. due to cracking of intermetallic phases in the solder
7. Short circuits due to whisker formation in lead-free solders or coatings
8. Cable breaks on control unit due to design errors